Cover of Modeling and Simulation for Microelectronic Packaging Assembly by Liu, Shen, ISBN 9780470827802
Circuits

Modeling and Simulation for Microelectronic Packaging Assembly

Contributor(s): Author Format: Hardback

Hardback ยท ISBN 9780470827802

โ‚น13,829 3%
โ‚น14,184

Inclusive of GST and other taxes

100% Quality Assurance
No Account Creation Required
Fast Delivery
Secured Transactions

Arriving at your doorstep in 10-15 days

Our logisitcs team will make sure everyitem is delivered safely

Key Specifications

ISBN 9780470827802
Publisher Wiley
Publication date August 2011
Language English
MRP ยฃ109.95 GBP
Page count 588
Item weight 249 g

Modeling and Simulation for Microelectronic Packaging Assembly published by Wiley.