Cover of Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments by Cepeda-Rizo, Juan, Gayle, Jeremiah, Ravich, Joshua, ISBN 9781032160818
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Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

Contributor(s): Author , Author , Author Format: Hardback

Hardback ยท ISBN 9781032160818

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Key Specifications

ISBN 9781032160818
Publisher CRC Press
Publication date December 2021
Language English
MRP ยฃ145.99 GBP
Page count 304
Item weight 133 g

Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments published by CRC Press.