Cover of Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments by Cepeda-Rizo, Juan, Gayle, Jeremiah, Ravich, Joshua, ISBN 9781032160856
Civil

Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

Contributor(s): Author , Author , Author Format: Paperback

Paperback ยท ISBN 9781032160856

โ‚น7,162

Inclusive of GST and other taxes

100% Quality Assurance
No Account Creation Required
Fast Delivery
Secured Transactions

Arriving at your doorstep in 10-15 days

Our logisitcs team will make sure everyitem is delivered safely

Key Specifications

ISBN 9781032160856
Publisher CRC Press
Publication date August 2024
Language English
MRP ยฃ50.99 GBP
Page count 306
Item weight 95 g

Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments published by CRC Press.