Cover of Microelectronics Packaging Handbook : Technology Drivers Part I by Tummala, Rao, Rymaszewski, Eugene J., Klopfenstein, Alan G., ISBN 9781461368298
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Microelectronics Packaging Handbook : Technology Drivers Part I

MICROELECTRONICS PACKAGING HAN

Contributor(s): Author , Author , Author Format: Paperback

Paperback · ISBN 9781461368298

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Key Specifications

ISBN 9781461368298
Subtitle MICROELECTRONICS PACKAGING HAN
Publisher Springer
Publication date October 2012
Language English
MRP £179.99 GBP
Page count 752
Item weight 228 g

Microelectronics Packaging Handbook : Technology Drivers Part I published by Springer.