Cover of Power Electronic Packaging : Design, Assembly Process, Reliability and Modeling by Liu, Yong, ISBN 9781461410522
Condensed Matter

Power Electronic Packaging : Design, Assembly Process, Reliability and Modeling

POWER ELECTRONIC PACKAGING 201

Contributor(s): Author Format: Hardback

Hardback ยท ISBN 9781461410522

โ‚น25,225 2%
โ‚น25,799

Inclusive of GST and other taxes

100% Quality Assurance
No Account Creation Required
Fast Delivery
Secured Transactions

Arriving at your doorstep in 10-15 days

Our logisitcs team will make sure everyitem is delivered safely

Key Specifications

ISBN 9781461410522
Subtitle POWER ELECTRONIC PACKAGING 201
Publisher Springer
Publication date February 2012
Language English
MRP ยฃ199.99 GBP
Page count 612
Item weight 227 g

Power Electronic Packaging : Design, Assembly Process, Reliability and Modeling published by Springer.