Cover of Thermomechanical Simulation Methodologies for Advanced Semiconductor Packaging by Zhang, Shuye, Sun, Guoli, ISBN 9781837241408
Circuits

Thermomechanical Simulation Methodologies for Advanced Semiconductor Packaging

Contributor(s): Author , Author Format: Hardback

Hardback · ISBN 9781837241408

₹14,505 2%
₹14,835

Inclusive of GST and other taxes

100% Quality Assurance
No Account Creation Required
Fast Delivery
Secured Transactions

Arriving at your doorstep in 10-15 days

Our logisitcs team will make sure everyitem is delivered safely

Key Specifications

ISBN 9781837241408
Publisher Institute of Electrical Engineers
Publication date May 2025
Language English
MRP £115.00 GBP
Page count 202
Item weight 102 g

Thermomechanical Simulation Methodologies for Advanced Semiconductor Packaging published by Institute of Electrical Engineers.