Cover of Interconnect Reliability in Advanced Memory Device Packaging by Gan, Chong Leong,, Huang, Chen-Yu,, ISBN 9783031267093
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Interconnect Reliability in Advanced Memory Device Packaging

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Paperback · ISBN 9783031267093

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Key Specifications

ISBN 9783031267093
Publisher Springer
Publication date April 2023
Language English
MRP £39.99 GBP
Page count 230
Item weight 73 g

Interconnect Reliability in Advanced Memory Device Packaging published by Springer.