Cover of Advanced Interconnect and Packaging by Zhao , Wensheng, ISBN 9783036567334
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Advanced Interconnect and Packaging

Contributor(s): Author Format: Hardback

Hardback ยท ISBN 9783036567334

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Key Specifications

ISBN 9783036567334
Publisher MDPI AG
Publication date February 2023
Language English
MRP ยฃ75.26 GBP
Page count 266
Item weight 171 g

Advanced Interconnect and Packaging published by MDPI AG.