Cover of Bonding in Microsystem Technology by Dziuban, Jan A., ISBN 9789048171514
Engineering (General)

Bonding in Microsystem Technology

BONDING IN MICROSYSTEM TECHNOL

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Paperback ยท ISBN 9789048171514

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Key Specifications

ISBN 9789048171514
Subtitle BONDING IN MICROSYSTEM TECHNOL
Publisher Springer
Publication date November 2010
Language English
MRP ยฃ129.99 GBP
Page count 352
Item weight 109 g

Bonding in Microsystem Technology published by Springer.