Name: Solder Paste in Electronics Packaging : Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly
Brand: Springer
SKU: 9789401160520
Price: 5675.00 INR
Availability: InStock
ISBN: 9789401160520

Solder Paste in Electronics Packaging : Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly

SOLDER PASTE IN ELECTRONICS PA

Contributor(s): Hwang, Jennie Author Format: Paperback

Paperback · ISBN 9789401160520

₹5,675 2%

₹5,804

Inclusive of GST and other taxes

100% Quality Assurance

No Account Creation Required

Fast Delivery

Secured Transactions

Arriving at your doorstep in 10-15 days

Our logisitcs team will make sure everyitem is delivered safely

Key Specifications

ISBN	9789401160520
Subtitle	SOLDER PASTE IN ELECTRONICS PA
Publisher	Springer
Publication date	February 2012
Language	English
MRP	£44.99 GBP
Page count	484
Item weight	142 g

Hwang, Jennie Author

Biography not available.

Solder Paste in Electronics Packaging : Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly

Key Specifications

Hwang, Jennie Author

Related titles