Cover of 3D Microelectronic Packaging : From Architectures to Applications by Li, Yan, Goyal, Deepak, ISBN 9789811570896
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3D Microelectronic Packaging : From Architectures to Applications

Contributor(s): Editor , Editor Format: Hardback

Hardback ยท ISBN 9789811570896

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Key Specifications

ISBN 9789811570896
Publisher Springer
Publication date November 2020
Language English
MRP ยฃ159.99 GBP
Page count 642
Item weight 236 g

3D Microelectronic Packaging : From Architectures to Applications published by Springer.